Intel CEO Lip-Bu Tan has openly admitted to global employees that Nvidia has surpassed Intel in the AI chip market. This candid acknowledgment underscores the company's dramatic fall from its former dominance in the semiconductor sector and highlights the scale of Intel's struggles in the AI era.

Samsung Electronics, once the crown jewel of South Korea's industrial might, is facing a growing crisis in its semiconductor division. A sharp downturn in high-bandwidth memory sales during the second quarter of 2025, combined with widening losses in its chip foundry operations, has raised serious questions about whether the company is losing its footing in the race to power artificial intelligence.

Eikei chairman Shih-Lin Liu stated that the impact of tariffs and exchange rates has temporarily eased, with customer orders gradually stabilizing. Looking ahead to the second half of 2025, following small-scale deliveries of US-based AI server cooling distribution unit (CDU) boards starting from the second quarter, the company expects a stable surge in orders in the third quarter, potentially driving an operational split of 40% in the first half and 60% in the second half of the year.

Taiwan's Forward Science Corp. (Forwardtek), a leading vacuum pump supplier, has launched its new V-pro smart vacuum pump and EcoNanoPur energy-saving system — an integrated platform that combines AI diagnostics, predictive maintenance, carbon tracking, and ESG-centric features for semiconductor manufacturing.

Nvidia is preparing to enter a new phase in the memory market by planning to deploy between 600,000 and 800,000 SOCAMM modules in 2025. This initiative positions SOCAMM as a potential successor to high-bandwidth memory (HBM). Although the initial deployment volumes are relatively modest compared to HBM, industry analysts suggest the move could trigger a wider transformation in the memory and substrate sectors.

SK Hynix is ramping up domestic semiconductor production as US export controls and geopolitical tensions prompt a broader reshuffling of the global memory supply chain. The company is expanding its M16 fab in Icheon and preparing its upcoming M15X fab in Cheongju to meet accelerating demand for high-bandwidth memory (HBM) DRAM used in AI and high-performance computing workloads.

EmBestor Technology, a Taiwan-based flash storage provider specializing in industrial applications, is poised to return to growth in the second half of 2025 as customers complete inventory digestion and resume orders. The company plans to introduce next-generation eMMC and PCIe SSD products, which are projected to contribute to higher revenue and maintain gross margins exceeding 40%. EmBestor aims to outperform its financial results from 2024.

Goldman Sachs recently released a striking report on the high-bandwidth memory (HBM) market, stating that regardless of forecasting scenarios, SK Hynix's monopoly over HBM will eventually come to an end.

InPsytech, a leading company under the Egis Technology Group specializing in high-speed semiconductor IP solutions, has completed its advanced design for TSMC's Face-to-Face (F2F) SoIC technology, fully compliant with the UCIe 2.0 (Universal Chiplet Interconnect Express) standard. This marks a significant achievement for high-speed interconnect capability for heterogeneous integrated chips.

Ichia Technologies, consistently receiving strong demand in consumer and automotive products, reported a consolidated revenue of NT$2.8 billion (approx. US$95.4 million) in the second quarter of 2025. This is an 18% increase from the prior year, along with a 20% gross margin. Their net profit after tax was NT$208 million (approx. US$7.1 million), a record quarterly profit for the company.